Cutting Chamber
1. Material:CASTING IRON ,HT 250
2. Application: electronics equipment, machinery equipment, chemicals equipment
3. Machining Processing : Machining + Electrophoresis surface treatment.
4. Max Dimension (mm): ( L x W X H) = 5435 mm × 2430 mm × 3430 mm (including cantilever)
5. Tolerence: Surface parallelism 0.02 mm, Position 0.02 mm, Flatness 0.02 mm
6 : WEIGHT: 1000kg - 10000 kg
Cutting Chamber VS. CNC Machining Service
The cutting chamber is primarily used for cutting solar monocrystalline silicon, polycrystalline silicon, and other materials. It is particularly suitable for the efficient cutting of large-sized silicon wafers, such as 182×182 mm, 182×210 mm, 210×210 mm, 230×230 mm, and 210 half-wafers.
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Details |
Material |
HT250 |
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Processing Technology |
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Weight |
5663KG 9769KG |
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Technical Parameters |
Maximum workpiece size: 230 × 230 × 950 mm Roller size: Φ150 mm - Φ160 mm × 960 mm (coating length) Wire wheel storage capacity: 120-240 km Cutting wire diameter: Φ0.025 - 0.06 mm Cutting wire speed: ≤2400 m/min Roller spacing: 310 mm (105 × 210 mm / 91 × 182 mm) 360 mm (182 × 182 mm / 182 × 210 mm) 395 mm (210 × 210 mm) 410 mm (230 × 230 mm) Power supply / power consumption: 3-phase 380V / 120 KVA (Max 260 KVA) Cutting fluid volume: 800 L Machine dimensions (L × W × H): 5435 mm × 2430 mm × 3430 mm (including cantilever) |
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Target Customer Groups |
The manufacturing industry is one of the main customer groups for cutting machines. It includes various sectors, such as electronics, machinery, chemicals, and more. |
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Processing Time |
89H |
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