Lower Connection Plate

The lower connecting plate is the core connecting part of the silicon wafer polishing equipment and is mainly used in the rotary support structure.

Material: GCr15

Processing Technology

Machining and surface treatment.

CNC machines are used for cutting and forming, and multiple processes such as turning and milling are used to ensure accuracy. Then heat treatment and surface treatment are carried out to improve strength and corrosion resistance, and finally quality inspection is carried out to ensure compliance with standards.

Weight: 600KG

Technical Parameters: 0.01

Target Customer Groups: Large vertical polishing equipment industry

Specialty Processes

We have independent production capabilities and rich experience in the entire process from mechanical processing to surface treatment. We have clean rooms of Class 1000 and Class 100, and can provide full process services for component surface treatment, cleaning, and refurbishment for domestic and foreign semiconductor equipment manufacturers according to customer needs.

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