Cutting Chamber Body

Crystal slicing equipment for photovoltaic silicon, semiconductor silicon, and sapphire

The cutting chamber body has a compact structure and precise design, making it suitable for high-precision cutting operations. Made from special alloy materials, it offers excellent heat and wear resistance, ensuring stable performance in high-temperature environments. The modular design also facilitates maintenance and upgrades.

Material：Special alloy steel/QT600-3

Processing Technology

First, the material is cut and formed, and then the frame is assembled by welding or bolting. The surface treatment includes sandblasting to remove rust, applying an anti-rust primer, and finally, powder coating or electroplating to enhance wear resistance and aesthetics.

1. Rough machining.
2. Annealing.
3. Semi-finishing, first and second order.
4. Finishing of shaft holes.
5. Machining of inner cavities.

Weight：Depending on the model, generally between 100-400kg

Use Scenarios：Metal processing, precision cutting

Target Customer Groups：Metal processing companies, precision manufacturing plants,Photovoltaic, semiconductor industry

Dimensional tolerance：

The concentricity of the shaft hole is 0.02
Cylindricity is 0.02
The verticality of the hole surface is 0.015
The parallelism of the surface is 0.02

Processing time：90H

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